Join CAPLINK at LEAP EAST 2026 Hong Kong CAPLINK is pleased to participate in LEAP EAST 2026, where we will showcase our latest consumer and embedded storage solutions. July 8-10,2026 Booth H3.O10 Hong Kong Convention and Exhibition Centre Our product portfolio includes: · DDR3 / DDR4/ DDR5 Memory Modules · Internal SSDs · Portable SSDs · USB Flash Drives · TF & SD Memory Cards · eMMC Solutions We are actively seeking: Regional Distributors Brand Partners Importers & Wholesalers System Integrators Strategic Business Partners If you are looking for a reliable storage solution provider with strong supply chain capabilities and flexible OEM/ODM support, we would be delighted to meet you at the show. 💡 Want faster support at the exhibition? 📩 Message us now to: ✔ Book a 1-on-1 meeting at our booth ✔ Request product samples in advance ✔ Get a customized quotation for your project Don't wait until the show—secure your priority access today. #CAPLINK #LEAPEAST2026 #TechExpo #SSD #Memory #DDR5 #StorageSolutions #Electronics #B2B #OEM #ODM #HongKongExhibition #TechIndustry
